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  november 2010 doc id 7757 rev 8 1/11 11 stps30150c high voltage power schottky rectifier features high junction tem perature capability good trade-off between leakage current and forward voltage drop low leakage current insulated package: to-220fpab ? insulating voltage = 2000 v dc ? capacitance = 45 pf avalanche capability specified description dual center tap schottky rectifier designed for high frequency switched mode power supplies. table 1. device summary i f(av) 2 x 15 a v rrm 150 v t j (max) 175 c v f (max) 0.75 v a1 k a2 a1 a2 k k a2 a1 a1 a 2 k k a2 a1 to-247 stps30150cw to-220fpab stps30150cfp d 2 pa k stps30150cg to-220ab stps30150ct www.st.com
characteristics stps30150c 2/11 doc id 7757 rev 8 1 characteristics when the diodes 1 and 2 are used simultaneously : tj(diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode 2) x r th(c) table 2. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 150 v i f(rms) forward rms current 30 a i f(av) average forward current = 0.5 to-220fpab t c =120 c per diode per device 15 a to-220ab to-247/d 2 pa k t c = 155 c 30 i fsm surge non repetitive forward current t p = 10 ms sinusoidal 220 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 10500 w t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink 175 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal resistances symbol parameter value unit r th (j-c) junction to case to-220fpab per diode to t a l 4 3.3 c/w to-220ab/d 2 pa k per diode to t a l 1.6 0.85 to-247 per diode to t a l 1.5 0.8 r th (c) coupling to-220fpab 2.6 to-220ab/d 2 pa k / to - 2 4 7 0 . 1 d ptot dtj - -------------- 1 rth j a ? () ------------------------- - <
stps30150c characteristics doc id 7757 rev 8 3/11 table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: tp = 5ms, < 2% reverse leakage current t j = 25 c v r = v rrm 6.5 a t j = 125 c 8 ma v f (2) 2. pulse test: tp = 380 s, < 2% to evaluate the conduction losses use the following equation: p = 0.64 x i f(av) + 0.0073 i f 2 (rms) forward voltage drop t j = 25 c i f = 15 a 0.92 v t j = 125 c i f = 15 a 0.69 0.75 t j = 25 c i f = 30 a 1 t j = 125 c i f = 30 a 0.8 0.86 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5, per diode) 0 1 2 3 4 5 6 7 8 9 101112131415161718 0 2 4 6 8 10 12 14 = 0.05 = 0.1 = 0.2 = 0.5 = 1 t =tp/t tp p (w) f(av) i (a) f(av) 0 2 4 6 8 10 12 14 16 18 0 25 50 75 100 125 150 175 rth(j-a)=15c/w rth(j-a)=rth(j-c) rth(j-a)=rth(j-c) to-220fp to-220ab / to-247 / d pak 2 t =tp/t tp i (a) f(av) t (c) amb figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0 .001 0.01 0.1 0.01 1 0.1 10 100 100 0 1 t (s) p p(t p ) p (1 s) arm arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm
characteristics stps30150c 4/11 doc id 7757 rev 8 figure 5. non repetitive surge peak forward current vs. overload duration (max. values, per diode) figure 6. non repetitive surge peak forward current vs. overload duration (max. values, per diode) (to-220fpab) 0 25 50 75 100 125 150 175 200 225 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 i (a) m t(s) tc=50c tc=75c tc=125c to-220ab, to-247, d pak 2 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 i (a) m t(s) tc=50c tc=75c tc=125c to-220fpab figure 7. variation of thermal impedance junction to case versus pulse duration (per diode) figure 8. variation of thermal impedance junction to case versus pulse duration (per diode) (to-220fpab) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 t =tp/t tp = 0.5 = 0.2 = 0.1 single pulse z/r th(j-c) th(j-c) t (s) p to-220ab, to-247, d pak 2 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 t =tp/t tp = 0.5 = 0.2 = 0.1 single pulse z/r th(j-c) th(j-c) t (s) p to-220fpab figure 9. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 10. junction capacitance versus reverse voltage applied (typical values, per diode) 0 2 550 7 5 1 00 12 5 1 50 1e-1 1e+0 1e+1 1e+2 1e+3 1e+4 1e+5 tj=125c tj=25c tj=150c tj=100c tj=175c i (a) r v (v) r 12 5 10 20 50 100 200 10 100 1000 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j
stps30150c characteristics doc id 7757 rev 8 5/11 figure 11. forward voltage drop versus forward current (maximum values, per diode) figure 12. thermal resistance junction to ambient versus copper surface under tab for d 2 pak 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 i (a) fm v (v) fm t =25c (maximum values) j t =125c (maximum values) j t =125c (typical values) j 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 s(cu)(cm2) r (c/w) th(j-a) epoxy printed circuit board fr4, copper thickness: 35m
package information stps30150c 6/11 doc id 7757 rev 8 2 package information epoxy meets ul94, v0 cooling method: (c) conduction recommended torque values (to-220fpab, to-220ab: 0.4 to 0.6 nm torque values (to-247): 0.55 nm recommended, 1.0 nm maximum in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 5. to-220fpab package dimensions ref dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 2.5 2.7 0.098 0.106 d 2.5 2.75 0.098 0.108 e 0.45 0.70 0.018 0.027 f 0.75 1 0.030 0.039 f1 1.15 1.70 0.045 0.067 f2 1.15 1.70 0.045 0.067 g 4.95 5.20 0.195 0.205 g1 2.4 2.7 0.094 0.106 h 10 10.4 0.393 0.409 l2 16 typ. 0.63 typ. l3 28.6 30.6 1.126 1.205 l4 9.8 10.6 0.386 0.417 l5 2.9 3.6 0.114 0.142 l6 15.9 16.4 0.626 0.646 l7 9.00 9.30 0.354 0.366 dia. 3.00 3.20 0.118 0.126 h l3 l2 l4 l6 g g1 f f1 l5 d e l7 a b dia f2
stps30150c package information doc id 7757 rev 8 7/11 figure 13. footprint dimensions (in millimeters) table 6. d 2 pak package dimensions ref dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 a c2 d r a2 m v2 c a1 g l l3 l2 b b2 e * * flat zone no less than 2mm 8.90 3.70 1.30 5.08 16.90 10.30
package information stps30150c 8/11 doc id 7757 rev 8 table 7. to-220ab package dimensions ref dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.067 f2 1.14 1.70 0.044 0.067 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151 a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m
stps30150c package information doc id 7757 rev 8 9/11 table 8. to-247 package dimensions ref dimensions millimeters inches min. typ. max. min. typ. max. a 4.85 5.15 0.191 0.203 d 2.20 2.60 0.086 0.102 e 0.40 0.80 0.015 0.031 f 1.00 1.40 0.039 0.055 f1 3.00 0.118 f2 2.00 0.078 f3 2.00 2.40 0.078 0.094 f4 3.00 3.40 0.118 0.133 g 10.90 0.429 h 15.45 15.75 0.608 0.620 l 19.85 20.15 0.781 0.793 l1 3.70 4.30 0.145 0.169 l2 18.50 0.728 l3 14.20 14.80 0.559 0.582 l4 34.60 1.362 l5 5.50 0.216 m 2.00 3.00 0.078 0.118 v 5 5 v2 60 60 dia. 3.55 3.65 0.139 0.143 f2 f1 v2 l4 l2 l1 l3 d l l5 me h v v a dia. f3 f4 g = = f(x3)
ordering information stps30150c 10/11 doc id 7757 rev 8 3 ordering information 4 revision history table 9. ordering information order code marking package weight base qty delivery mode stps30150ct stps30150ct to-220ab 2 g 50 tube stps30150cfp stps30150cfp to-220fpab 1.9 g 50 tube stps30150cw stps30150cw to-247 4.4 g 30 tube stps30150cg stps30150cg d 2 pa k 1.48 g 50 tube stps30150cg-tr stps30150cg d 2 pa k 1.48 g 1000 tape and reel table 10. document revision history date revision changes feb-2004 7 previous release. 26-nov-2010 8 added ecopack statem ent. corrected package name in figure 12 .
stps30150c doc id 7757 rev 8 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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